Scientific terms with B

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Backscattering: The scattering of particles or waves back in the direction from which they came.

Band gap: The energy range in a solid material in which no electrons are able to occupy energy states.

Band structure: The distribution of electronic energy levels within a solid material, as determined by its crystal structure.

Bandgap: The energy gap between the valence band and the conduction band in a solid material.

Barium titanate: A ceramic material with the chemical formula BaTiO3, used as a dielectric in capacitors.

Barrier layer: A layer of material that is used to prevent the diffusion of atoms or molecules from one material to another.

Base material: The material upon which a coating or other layer is applied.

Beam: A structural element that is designed to resist bending and shear forces.

B-H curve: A graph showing the relationship between the magnetic field strength (B) and the magnetic field intensity (H) in a material.

Biodegradable: A material that can be broken down into natural products by living organisms.

Biomaterial: A material that is used in medical devices or implants, either as a replacement for a missing part of the body or to assist in the repair of a damaged or diseased tissue.

Birefringence: The property of a material to have different refractive indices for light polarized in different directions.

Birefringence: The property of a material to have two different refractive indices for light traveling in different directions through the material.

Bond strength: The measure of the strength of the bond between atoms or molecules in a material.

Bond: The attractive force between atoms or molecules that holds them together.

Bonding energy: The energy required to break the bond between atoms or molecules in a material.

Bonding mechanism: The process by which atoms or molecules form a bond.

Boron carbide: A hard, abrasive material with the chemical formula B4C, used as an abrasive and a neutron absorber.

Boron: A chemical element with the atomic number 5 and the symbol B. It is a hard, brittle metalloid that is used as a dopant in semiconductor materials.

Bouncing: The process of a material rebounding or bouncing back after being subjected to a force.

Boundary layer: A thin layer of material that is adjacent to a surface and is subjected to different conditions than the material further away from the surface.

Brazing: A metal joining process in which two or more metal parts are joined together by melting and flowing a filler metal into the joint.

Breakaway: The point at which a material fails or breaks under a load.

Breakdown: The point at which a material fails or breaks down under a load.

Breaking strength: The maximum stress that a material can withstand before breaking.

Brittle: A term used to describe materials that are prone to breaking or cracking under stress rather than deforming.

Brittleness: The property of a material to break or shatter rather than deforming when subjected to a load.

Bronzing: A process in which a thin layer of bronze is applied to a surface.

Brookite: A form of titanium dioxide that has a monoclinic crystal structure.

Brownian motion: The random motion of particles suspended in a fluid, caused by the random motion of the fluid molecules.

Bruising: The process of deforming a material by applying a load that exceeds its yield strength.

B-stage resin: A type of thermosetting resin that has been partially cured and is in a semi-solid state.

Buckle: A type of deformation that occurs when a material is subjected to a compressive load.

Buckling: A type of structural failure that occurs when a compressive load causes a column or other structural member to deform laterally.

Buffer layer: A thin layer of material that is used to separate two other materials in order to reduce their interaction.

Bulk density: The mass of a material per unit volume.

Bulk hardening: A type of strengthening mechanism in which a material is made stronger by increasing the size of its crystals or grains.

Bulk modulus of elasticity: A measure of the stiffness of a material. It is the ratio of the applied pressure to the fractional change in volume of the material.

Bulk modulus: A measure of the compressibility of a material. It is the ratio of the pressure applied to the fractional decrease in volume of a material.

Bulk modulus: The ratio of a material's volume change to the applied pressure that caused the change.

Bulk viscosity: The resistance of a fluid to flow under an applied stress.

Buried interface: An interface between two materials that is not exposed to the surface.

Burnishing: A process in which a surface is polished or smoothed by rubbing it with a hard, smooth tool.

Burns: A term used to describe the process of oxidizing a material by heating it in the presence of oxygen.

Bursting strength: The maximum load that a material can withstand before it ruptures or bursts

Burying: The process of coating a surface with a layer of another material in order to protect it from the environment or to improve its performance.

Butt weld: A type of weld that is made by joining two metal parts together at their edges.

B-value: A measure of the elastic stiffness of a material, equal to the slope of the stress-strain curve in the linear elastic region.

Bypass: A type of material that allows electrons or other charge carriers to flow around a region of a material rather than through it.

Bytellurgy: The study of the behavior of materials under high pressure.

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